HLB

Lachè

Aluminèm

HLB & HLC

Aplikasyon: Estructure HHPC: 18L PCB Thickness: 2.5 mm liyen/Spa: 0.086 / 0.089 mm Min. Diamete lou: 0.2 mm Via Surface fini: Karakterik prozes ENIG: TU883 Back-drilling, POFV

Lachè

Stamp, aluminyòm

HDI

Aplikasyon: Mini LED (P0.58) 0.050 / 0.050 mm Min. Diamèt: 0.076 mm Laser Via Surface fini: Karakteris ENIG Prosès: 2 6 2,0.1 mm PAD gas 60 μm

HDI

Aplikasyon: Aktrè Kart AI akcelerator: 18L HDI Thickness: 1.57 mm liyen/Spaz: 0.060 / 0.100 mm Min. Diameter: 0.10 mm Laser Via Surface fini: Lòn plate dnger OSP Process: Anylayer, Disyan X-hole, 8 fwa laminations, strict liye.