HLB

Ketai sink

Profil aluminum

HLB & HLLC

Aplika: HPCC Structure: 18L PCB Keyai: 2.5mm Line Lean / Space: 0.086 / 0.089 mm Min. Tut: 0.2 mm Via Surface Ngasa: ENIG Process Characteris: TU883 Back-drilling, POFV

Ketai sink

Penging, profil aluminum

HDI

Aplika: Mini LED (P0.58) Struture: 10L HDI Peckness: 0.050 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Nuan: ENIG Characteris Process: 2 6 2,0.1 mm PAD 60μm

HDI

Aplika: AI Accelerator Kard Structure: 0.060 / 0.100 mm Min. Hole Diameter: 0.10 mm Laser Via Surface Ngua: Menyas: X-hole disena , 8, calo laminations, layer began