HLB

wadhah panas

Alumino

HLB & HLC

Aplika: HPCC Structure: 18L PCB Keckness: 2.5mm Line winth / Spas: 0.086 / 0.089 mm Min. Diameter Hole: 0.2 mm Via Surface Ngang: ENIG Prosess: TU883 Back-drilling, POFV

Vat

Undo-type

HDI

Aplika: Mini LED (P0.58) 0.050 / 0.050 mm Min. Diameter Hole: 0.076 mm Laser Via Surface Ngang: Proses ENIG: 2 6 2,0.1 mm PAD gah 60μm

HDI

Aplika: Karta Accelerator 0.060 / 0.100 mm Min. Diameter Hole: 0.10 mm Laser Via Surface Ngang: Plating Gold OSP Prosess Proses: Anylayer, undo-type