HLB

Iuram

Profil aluminio

HLB & HLC

Application: HHPC structura: 18L PCB Thickness: 2.5mm Linea Larth/Space: 0.086 / 0.089 mm Min. Diameteria: 0.2 mm Via Surface finis: ENIG Processa Characteristica: TU883 Back-drilling, POFV

Iuram

Lampita, aluminium profilae

HDI

Programm: Mini LED (P0.58) Structura: 10L HDI Thissue: 1.2 mm Linia: 0.050 / 0.050 mm Min. Diameter: 0.076 mm Laser Via Surface finis: ENIG Processa Characteristica: 2 6,0 mm PAD spita 60μm

HDI

Programm: AI AI Cructura cardas accelerator: 18L HDI Thistere: 1.57mm Linia Prod/Spae: 0.060 / 0.100 mm Min. Hole Diameter: 0.10 mm Laser Via Surface finis: Aure plating OSP Process Characteristics: Anylayer, X-hole designa, 8 septis lamination, stricte