HLB

Yjatlany

Alumiýmak

HLB & HLC

Apil: HHPC Structure: 18L PCB Kisi: 2.5mm Saýynçysy: 0.086 / 0.089 mm Min. Gükçe diýimer: 0.2 mm ýygyçysy doly tamamlan: ENIG Prosese hasaplary: TU883 Back-drilling, POFV

Yjatlany

Köpmek, aluminis profily

HDI

Emblemançy: Mini LED (P0.58) Gurama: 10L HDI Kiçilik: 1.2 mm Saýynçylary/Argaly: 0.050 / 0.050 mm Min. Göýt Diameter: 0.076 mm Laser Via Surface tamamlan: ENIG Prosese hasyly 2 6 2,0.1 mm PAD bata 60 μm

HDI

Emblemançy: AI Seçelerator Kart gurluçy: 18L HDI Kiçigi: 1.57mm Saýynçy/Bir: 0.060 / 0.100 mm min. Göýtdi: 0.10 mm Laser Via Surfacey tamamlan: Altyn satlany OSP process hasaplary: Anylayer, X-hole tasyny, 8 tärli laminçysy, dürli gaty kolysy