HLB

Heat sink

Aluminum profile

HLB & HLC

Application: HPCC Structure: 18L PCB Thickness: 2.5mm Line Width/Space:0.086 / 0.089 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: TU883 Back-drilling, POFV

Heat sink

Stamping, aluminyo profile

HDI

Application: Mini LED (P0.58) Structure: 10L HDI Thickness: 1.2 mm Line Width/Space: 0.050 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Finish: ENIG Process Characteristics: 2 6 2,0.1mm PAD gap 60 μm

HDI

Application: AI Accelerator Card Structure: 18L HDI Thickness: 1.57mm Line Width/Space: 0.060 / 0.100 mm Min. Hole Diameter: 0.10 mm Laser Via Surface Finish: Gold plating finger OSP Process Characteristics: Anylayer, X-hole disenyo ,8 beses laminations, strict layer alignment