High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
"/> High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
"/> High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
"/>
Product & Technology
Product & Technology

Product Application

Production Environment

Advanced Equipment

Technology Roadmap

Products Display

Online consultation

Feel free to leave us a message and receive a free product quote.

Submit

MLB & HLC

MLB & HLC

Application：Switch (400G) Structure：28L MLB Thickness：146 mil Line width / Space：3.9 / 3.9 mil Min. Aperture：15.7 mil Via  Surface Treatment：Gold Technological Feature：IT-988GSE, Back Drilling, POFV

MLB & HLC

Application：Switch Structure： 20L MLB Thickness： 102 mil Line width / Space： 3.5 / 4.0 mil Min. Aperture： 9.8 mil Via  Surface Treatment： OSP Technological Feature：Resin Plug Hole, POFV, N+N Stack-up

MLB & HLC

Application：Supercomputer Server Structure： 24L MLB Thickness： 118 mil Line width / Space： 2.9 / 3.0 mil Min. Aperture： 7.9 mil Via  Surface Treatment： ENIG Technological Feature：Resin Plug Hole, POFV, Twice Pressing, Blind and Buried Via

MLB & HLC

Application：HPC Structure： 18L MLB Thickness： 98 mil Line width / Space： 3.4 / 3.5 mil Min. Aperture： 7.9 mil Via  Surface Treatment： OSP Technological Feature：TU883, Back drilling, POFV

MLB & HLC

Application：Server Structure： 20L MLB Thickness： 94 mil Line width / Space： 3.7 / 4.0 mil Min. Aperture： 7.9 mil Via  Surface Treatment： ENIG Technological Feature：Back drilling, POFV

MLB & HLC

Application：GPU Riser Card Structure： 18L Anylayer Thickness： 86.6 mil Line width / Space： 3.5 / 3.0 mil Min. Aperture： 7.9 mil Via  Surface Treatment： ENIG+GF Technological Feature：Segmented Golden Finger, Back drilling, Resin Plug Hole, POFV

< 1 >
CEE PCB

+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

图片名称
图片名称
图片名称
图片名称

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

CEE Electronics attaches great importance to your personal privacy. When you visit our website, please agree to the use of all cookies. More information about personal data processing can be accessed

© Copyright 2026. Huizhou CEE Technology lnc.  All rights reserved.  Privacy policy