High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
"/> High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
"/> High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
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MLB & HLC

MLB & HLC

Resin-plug vias,POFV,2 times pressing with blind & buried vias

MLB & HLC

Application: Switch Structure: 28L PCB Thickness: 3.7 mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics:IT-988GSE, Back Drilling+POFV

MLB & HLC

Application: Server Structure:  20L PCB Thickness: 2.4mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: Back-drilling,POFV

HLB & HLC

Application:HPC Structure:  18L PCB Thickness: 2.5mm Line Width/Space:0.086 / 0.089 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: TU883 Back-drilling,POFV

MLB & HLC

Application: GPU Accelerator Card Structure:  16L PCB Thickness:  2.2 mm Line Width/Space: 0.089 / 0.076 mm Min. Hole Diameter:  0.2 mm Via Surface Finish:  ENIG+Goldfinger Process Characteristics: Steps Goldfingers,Back-drilling,POFV,Resin-plug vias

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