HDI

Application：AI Accelerator Card Structure：18L Anylayer Thickness：62 mil Line width / Space：2.4 / 3.9 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：Gold Plating Finger+ENIG Technological Feature：Any layer, X-Slot Via Design, Pressing 8 times, High alignment requirements

Application：AI Accelerator Card

Structure：18L Anylayer

Thickness：62 mil

Line width / Space：2.4 / 3.9 mil

Min. Aperture：3.9 mil Laser Via

Surface Treatment：Gold Plating Finger+ENIG

Technological Feature：Any layer, X-Slot Via Design, Pressing 8 times, High alignment requirements

Category: HDI

Product Inquiries:

+86-752-5703333

Product Inquiry

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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