R-F

Application：Display Module Structure：10L R-F Thickness：27.6 mil Line width / Space：3.0 / 3.4 mil Min. Aperture：Bilnd Via 3.9 mil, PTH 5.9 mil Surface Treatment：ENIG Technological Feature：HDI 2 Steps R-F

Application：Display Module

Structure：10L R-F

Thickness：27.6 mil

Line width / Space：3.0 / 3.4 mil

Min. Aperture：Bilnd Via 3.9 mil, PTH 5.9 mil

Surface Treatment：ENIG

Technological Feature：HDI 2 Steps R-F

Category: R-F

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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