R-F

Application：Smart Headphones Structure：10L R-F Thickness：31.5 mil Line width / Space：3.0 / 3.4 mil Min. Aperture：Bilnd Via 3.0 mil, PTH 21.7 mil Surface Treatment：ENIG Technological Feature：HDI 3 Steps R-F

Application：Smart Headphones

Structure：10L R-F

Thickness：31.5 mil

Line width / Space：3.0 / 3.4 mil

Min. Aperture：Bilnd Via 3.0 mil, PTH 21.7 mil

Surface Treatment：ENIG

Technological Feature：HDI 3 Steps R-F

Category: R-F

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+86-752-5703333

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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