MLB & HLC
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  • MLB & HLC

MLB & HLC

Application:Supercomputer Server Structure: 24L MLB Thickness: 118 mil Line width / Space: 2.9 / 3.0 mil Min. Aperture: 7.9 mil Via  Surface Treatment: ENIG Technological Feature:Resin Plug Hole, POFV, Twice Pressing, Blind and Buried Via

Application:Supercomputer Server
Structure: 24L MLB
Thickness: 118 mil
Line width / Space: 2.9 / 3.0 mil
Min. Aperture: 7.9 mil Via 
Surface Treatment: ENIG
Technological Feature:Resin Plug Hole, POFV, Twice Pressing, Blind and Buried Via

Multilayer Board (MLB) and High Layer Count (HLC) PCB solutions are designed to meet the increasing demand for high-speed, high-density, and high-performance electronic applications. MLB PCBs integrate multiple conductive copper layers into a compact structure, while HLC PCBs feature advanced layer configurations that support complex routing, enhanced signal integrity, and improved electrical performance. These technologies enable efficient power distribution, reduced electromagnetic interference, and reliable transmission in sophisticated electronic systems. MLB & HLC PCBs are widely used in telecommunications, data centers, automotive electronics, medical equipment, aerospace systems, industrial control devices, and AI servers. With precise manufacturing processes, controlled impedance design, blind and buried vias, and superior thermal management capabilities, MLB & HLC PCBs provide stable performance and long-term reliability for demanding applications. 

 

Category: MLB & HLC

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